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Exemption 7:

"a)  Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
b)  Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,
c) Lead in electronic ceramic parts (e.g. piezoelectronic devices)"

Stakeholder contribution

Exemption 7a: Contribution by Michel Pecht, University of Maryland submitted 25 March 2008

Exemption 7a: Contribution by Syfer Technology Limited submitted 31 March 2008

Exemption 7a: Contribution by EICTA, AeA Europe, EECA ESIA and ZVEI submitted 1 April 2008

Exemption 7a:  Contribution by Japan Business Council in Europe submitted 1 April 2008

Exemption 7b: Contribution by EICTA, AeA Europe and EECA ESIA submitted 1 April 2008

Exemption 7c: Contribution by Emerson submitted 25 March 2008 (ZIP)

Exemption 7c:  Contribution by Sunlead Viction Technology Electronic (Guangzhou) Ltd.  submitted 28 March 2008

Exemption 7c: Contribution by CeramTec AG submitted 31 March 2008

Exemption 7c: Contribution by Céram Unie submitted 31 March 2008

Exemption 7c: Contribution by PerkinElmer Optoelectronics GmbH & Co. KG submitted 1 April 2008

Exemption 7c: Contribution by EICTA, AeA Europe, EECA ESIA and ZVEI submitted 1 April 2008

Exemption 7c: Contribution by Ferroperm Piezoceramics A/S submitted 1 April 2008

Exemption 7c: Contribution by Japan Business Council in Europe submitted 1 April 2008

Exemption 7, general comments:

Contribution by Test & Measurement Coalition submitted 31 March 2008

Contribution by Vishay SA submitted 31 March 2008

Contribution by European Lamp Companies Federation submitted 31 March 2008

Contribution by Céram Unie submitted 31 March 2008

Contribution by COCIR, Eucomed and EDMA submitted 1 April 2008

Contribution by Ringhals AB submitted 1 April 2008