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Exemption 15

"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages"

This section includes a questionnaire for a new RoHS exemption request. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.

 

Applicant's documents

> Original exemption request

 > Additional information provided after first questions for clarification:

Results from previous evaluations

> Excerpt from Oeko-Institut report 2009 (PDF)

>> Further information by applicant

 

Contributions to the consultation

> Contribution by Infinera, submitted 16 October 2015, PDF

> Contribution by Test & Measurement Coalition, General comments related to RoHS exemption package 9, submitted 19 October 2015, PDF