Exemption 7(a)
"Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)"
This section includes a questionnaire for a new RoHS exemption request. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.
Applicant's documents
Applicant 1: Bourns Inc.
> Additional information provided after first questions for clarification:
>> Further information by applicant
Applicant 2: IXYS Semiconductor GmbH
> Additional Information - DE1944181A_BBC.pdf
> Additional information provided after first questions for clarification:
>> Further information by applicant
>> Additional file d - International Standard IEC_CEI 60747-2
>> Additional file e - International Standard IEC_CEI 60747-6
>> Additional file f - International Standard IEC_CEI 60747-8
>> Additional file g - International Standard IEC_CEI 60747-9
>> Additional file h - International Standard IEC_CEI 60747-15
>> Additional file i - International Standard IEC_CEI 60749-20
Applicant 3: Freescale Semiconductor
> Additional information provided after first questions for clarification:
>> Further information by applicant
>> Revised aplication for Exemption renewal
Results from previous evaluations
> Excerpt from Oeko-Institut report 2009 (PDF)
Contributions to the consultation
> Contribution by Bosch Security Systems GmbH, submitted 15 October 2015, PDF
> Contribution by JBCE – Japan Business Council in Europe in a.i.b.l, submitted 15 October 2015, PDF
> Contribution by Freescale Semiconductor, submitted 15 October 2015, PDF
> Contribution by Finnish Safety and Chemichals Agency, Ministry of Environment, submitted 16 October 2015, PDF
> Contribution by Test & Measurement Coalition, General comments related to RoHS exemption package 9, submitted 19 October 2015, PDF