Exemption 15
"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages"
This section includes a questionnaire for a new RoHS exemption request. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.
Applicant's documents
> Additional information provided after first questions for clarification:
Results from previous evaluations
> Excerpt from Oeko-Institut report 2009 (PDF)